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IEEE SmartGridComm Symposium on

Architectures and Models for the Smart Grid

Symposium Co-Chairs

Peter W. Sauer
University of Illinois at Urbana-Champaign, USA
Anna Scaglione
University of California at Davis, USA
Felix Wu
University of Hong Kong, Hong Kong

Scope and Motivation

The complexity of the communication, computing, and control of smart grid devices brings a host of research issues associated with performance, security, and interoperability. This symposium will focus on the architectural and modeling aspects of these issues and suggests the following topics of particular interest to foster innovation in power grid applications.

Topics of Particular Interest

Papers that contribute to the development of new architectures and models for technologies that provide security, interoperability, and performance standards are encouraged with emphasis on the following areas:

  1. Integration of innovative services that require a secure cyber infrastructure
  2. End use devices (relays, advanced meters etc.)
  3. Customer interface with energy providers (software and hardware)
  4. Wide-area measurement for monitoring and control (PMUs, visualization)
  5. Changes in the network architecture to address intermittent, green energy sources and the increased demands of electric vehicles
  6. Sensor network deployments, protocol and architectures for Smartgrid services
  7. Models and network protocols for real time information gathering, adaptive signal processing and compression of power-grid sensors data
  8. Collaborative execution, network synchronization and parallel processing models for Smartgrid services

Submission Guidelines

Submission deadlines and format requirements are the same for all symposia, see here

Papers can be submitted here

Technical Program Committee (TPC) Members

Howard Choe, Raytheon, USA
Michael Devetsikiotis, North Carolina State University, USA
Ian Dobson, University of Wisconsin-Madison, USA
Venizelos Efthymiou, Electricity Authority of Cyprus, Cyprus
Mark Klerer, Qualcomm, USA
Claudio Lima, Sonoma Innovation, USA
Moacyr Martucci, Universidade de São Paulo - Escola Politécnica da USP, Brazil
Moises Ribeiro, Federal University of Juiz de Fora, Brazil

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